Electronic Restoration >> Learn Fire Damage Electronic Repair

Static and dynamic burn-in shall be performed at maximum recommended operating supply voltage @ TA = 125 C . Biasing conditions including the value of RL shall be selected to assure that the junction temperature shall not exceed Tj max specified for the device type.2/ See MIL-HDBK-1331: Parameters to be controlled for the Specification of Microcircuits, Learn Fire Damage Electronic Repair for symbol definitions.

3/ These are typically recommended electrical parameters based on MIL specifications and SMDs. Since electrical parameters are device dependent, refer to detail specifications or manufacturing data sheets for actual DC and AC parametric test conditions and limits.4/ For digital devices, all DC parameters, functional tests, and Learn Fire Damage Electronic Repair switching tests shall be tested at 25 °C, at minimum operating temperature and at maximumoperating temperature.

For linear devices, all DC parameters shall be tested at 25 °C, at minimum operating temperature and at maximum operating temperature. All AC and Learn Fire Damage Electronic Repair switching tests shall be performed at 25 °C.5/ For level 1 and level 2 applications, one-time programmable devices (e.g., PROMs, PLDs/PLAs), shall be subjected to dynamic burn-in with userapplication specific burn-in circuit. 

The post burn-in should include DC, AC, and functional tests for user's program verification.6/ Dynamic burn-in required for level 1 applications.7/ Static or dynamic burn-in acceptable for level 2 and Learn Fire Damage Electronic Repair level 3 applications. Samples shall be selected from the parts that have passed the screening requirements in Table 2.2/ 

Subgroup 1 can be performed on electrical rejects.3/ Lot specific QCI attributes data is acceptable, Learn Fire Damage Electronic Repair provided it meets all inspection/test requirements of Table 3.4/ Generic QCI attributes data is acceptable, provided it meets inspection/test requirements of Table 3. QCI attributes data within 12 months of the lot datecode of flight parts may be purchased from the manufacturer and reviewed for acceptability in lieu of performing the required testing if the data satisfiesthe requirements in Table 3.

Use conditions specified in Table 2A (dynamic burn-in condition as applicable). Burn-in temperature and biasing conditions shall be selected to assurethat the junction temperature does not exceed Tjmax specified for the device type by the manufacturer.6/ Use of Mfr. Hi-Rel and commercial parts in level 1 and 2 applications requires use of SCD (or program specific Parts Plan) that specifies screening and Learn Fire Damage Electronic Repair qualification testing. 

SCD/Parts Plan shall include audit/survey requirements to ensure the manufacturer's quality/reliability procedures, assembly, andtesting criteria meets GSFC requirements.7/ For level 3 applications, no qualification testing is mandatory; however, Learn Fire Damage Electronic Repair it is strongly recommended that all non-QPL/QML devices have life test inaccordance with MIL-STD-883, Method 1005, conditions A-D (as appropriate for device type), for 1,000 hours at 125oC (or equivalent time/temperatureper Method 1005, Table 1). 

Use manufacturer's recommended operating conditions but do not exceed 90% of maximum supply voltage for digital devices and 80% of maximum supplyvoltage for linear devices. For voltage regulators, derate VIN - VOUT to 0.9.1.1/ For low voltage (< 5V) devices, Learn Fire Damage Electronic Repair use manufacturer's recommended operating conditions.

Do not exceed Tj = 110 °C or 40 °C below the manufacturer's maximum rating, whichever is lower.3/ Consult the project radiation engineer to determine derating guidelines that account for radiation induced degradation (total ionizing dose, single event effects, Learn Fire Damage Electronic Repair and displacement damage) in parts over the lifetime of each mission. 

The use of Plastic Encapsulated Microcircuits (PEMs) is permitted on NASA Goddard Space Flight Center (GSFC) space flight applications, provided each use is thoroughly evaluated for thermal, mechanical, and radiation implications of the specific application Learn Fire Damage Electronic Repair and found to meet mission requirements. 

PEMs shall be selected for their functional advantage and availability,not for cost saving; the steps necessary to ensure reliability usually negate any initial apparentcost advantage. A PEM shall not be substituted for a form, fit and functional equivalent, high reliability, Learn Fire Damage Electronic Repair hermetic device in space flight applications. 

Due to the rapid change in wafer-level designs typical of commercial parts and the unknowntraceability between packaging lots and wafer lots, lot-specific testing is required for PEMs,unless specifically excepted by the Mission Assurance Requirements (MAR) for the project.Lot-specific qualification, screening, radiation hardness assurance analysis, Learn Fire Damage Electronic Repair and/or testing shallbe consistent with the required reliability level as defined in the MAR.

Developers proposing to use PEMs shall address the following items in their PerformanceAssurance Implementation Plan: source selection (manufacturers and distributors); storageconditions for all stages of use; packing, shipping, and handling; electrostatic discharge (ESD);screening and qualification testing; derating; radiation hardness assurance; Learn Fire Damage Electronic Repair test house selection and control; Learn Fire Damage Electronic Repair and data collection and retention. 

Use of PEMs outside the manufacturer's ratedtemperature range requires written approval from GSFC. Specifically, PEMs must be: Stored under temperature controlled, clean conditions, Learn Fire Damage Electronic Repair protected from ESD andhumidity Traceable to the branded manufacturer Procured from the manufacturer or their approved distributor 

Tested to verify compliance with the performance requirements of the applicationenvironment over the intended mission lifetime Tested using practices and facilities with demonstrated capabilities sufficient to handleand test the technologies involved. Testing in accordance with PEM-INST-001 shall be performed as necessary to qualify and Learn Fire Damage Electronic Repair screen the devices, in order to verify compliance with the application requirements and projectrisk level, defined in the program MAR. 

Radiation evaluation shall address all threats appropriate for the technology, application, and environment, including Total Ionizing Dose(TID), Single Event Effects (SEE), and Learn Fire Damage Electronic Repair displacement damage. Existing radiation data can beused only with the review and approval of the project radiation specialist.

PEMs with manufacture dates older than 3 years before the time of installation shall not be used without GSFC approval. Derating of PEMs must be addressed with consideration ofspecific material, device construction, device characteristics, Learn Fire Damage Electronic Repair and application requirements.Use of PEMs with pure tin plated terminations requires special precautions to preclude failures caused by tin whiskers. 

GSFC approval of mitigation strategies is required. Exceptions to testing required by PEM-INST-001 may be permitted by GSFC on a case-by case basis, where it can be demonstrated that either existing lot-specific test data show acceptable results, Learn Fire Damage Electronic Repair or the use of high risk PEMs represents low risk of functional loss should the part fail. 

All rationale for such exceptions shall be documented.NASA will use part performance data collected in accordance with this policy to evaluate the policy's effectiveness and to develop Learn Fire Damage Electronic Repair recommendations for future improvements andstreamlining.

Colorado Floods Cause Mold Problems

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If the remediation job disturbs mold and mold spores become airborne, then the risk of respiratory exposure goes up. Actions that are likely to stir up mold include: breakup of moldy porous materials such as wallboard; invasive procedures used to examine or remediate mold growth in a wall cavity; ac  read more..

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